WinTech Nano (SHG: 688757)

WinTech Nano is a corporation based in Suzhou, China. Established in 2012, the company provides services in wafer thinning, dicing, polishing, and bonding. It offers advanced packaging solutions such as flip-chip and wafer-level packaging, along with MEMS processing and Through-Silicon Via (TSV) technology. The assets are managed by the executive management team.