Bochum, Germany · Founded 2019 · Privately Held (backing)
Developer of wafer dicing laser technology designed for cutting microchips and advanced semiconductor materials to improve precision and manufacturing efficiency. Lidrotec is based in Bochum, Germany and was founded in 2019. It has raised $19.2 million across 1 recorded round; the latest was a $13.5 million early-stage round in Apr 2025.
Last price · $/share
—
Implied valuation
—
Total raised
$19.2M
Last round
Early Stage VC
Apr 2025
Team — not yet on record
No current team members for Lidrotec are on record yet. People surface from round filings, company disclosures, and coverage sessions.
Pro members can request priority coverage with a 48-hour turnaround.
Free account
More of Lidrotec with a free account
·The complete investor list: 21 names
·Watch Lidrotec: the Monday email on marks, rounds and moves
