Bauplan key facts
- Developer of a serverless data platform designed to make serverless computing for data workloads using Python.
- It has raised $7.5M across 1 recorded rounds; the latest was Seed Round ($7.5M) in Mar 2025.
- Notable investors include South Park Commons, Innovation Endeavors, Materialized View Capital, Recursion Venture Capital, Aditya Agarwal — 20 tracked in total.
- Bauplan has filed 2 Form Ds with the SEC, most recently Aug 2025 ( sold).
- Status: Privately Held (backing).
Who backs Bauplan
20+- ·The complete investor list: 20 names
- ·Watch Bauplan: the Monday email on marks, rounds and moves
Bauplan funding rounds
1 roundsHow much has Bauplan raised?
Bauplan has raised $7.5 million across 1 recorded round since 2025. The largest was a $7.5 million seed round in Mar 2025.
Bauplan has filed 2 Form Ds with the SEC, most recently in Aug 2025 (null sold).
Bauplan investors
20 investors are on record for Bauplan, including South Park Commons, Innovation Endeavors, Materialized View Capital and Recursion Venture Capital. By type, the record holds 4 venture capital firms and 1 angel investor. The seed round in Mar 2025 drew 19 investors.
About Bauplan
Developer of a serverless data platform designed to make serverless computing for data workloads using Python. The platform offers versioning, automation, and scalable execution, eliminating infrastructure overhead while integrating directly with existing cloud storage and workflows for efficient data processing, enabling clients to make data workloads for data science, machine learning, and business Intelligence accessible.
- Industry
- Systems and Information Management
- Sector
- Information Technology
- HQ
- San Francisco, CA, United States
- Founded
- 2022
- Employees
- 10
- Website
- bauplanlabs.com/
- Ownership
- Privately Held (backing)
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Bauplan doesn't have a valuation on record yet — one is published once a priced round, a reported valuation, fund marks, or secondary prints surface in our sources. The rest of the record below builds toward it.